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Application Characteristics of Epoxy Fiberglass Board

Epoxy board, also known as epoxy fiberglass board, which is a kind of transformer insulation materials, epoxy phenolic laminated glass cloth board, model 3240, epoxy resin is generally refers to the organic polymer compound containing two or more epoxy groups in the molecule, except for some, their relative molecular weight is not high. The molecular structure of epoxy resin is characterized by the active epoxy group in the molecular chain, which can be located at the end, middle or ring-like structure of the molecular chain. Because of the active epoxy group in the molecular structure, they can react with many kinds of curing agents to form insoluble and immiscible polymer with three-way network structure.
insulating epoxy board for transformer
Epoxy board: fiberglass cloth is made by bonding with epoxy resin and heating and pressing. The model is 3240. It has high mechanical properties at medium temperature and stable electrical properties at high humidity. It is suitable for mechanical, electrical and electronic parts with high insulation structure. It has high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistance class F (155 degrees).
Specification and thickness: 0.5-100mm
General specification: 1000mm * 2000mm
Color: yellow
Origin: Domestic
Under the condition of high temperature of 180 ℃, it will deform when heated. Generally, it is not heated together with other metals, which may cause deformation of metal plate
Insulation glass fiber sheet
Application characteristics of epoxy board
1. There are various forms of epoxy board. All kinds of resin, curing agent and modifier systems can almost meet the requirements of various applications. Their range can be from very low viscosity to high melting point solid.
2. The epoxy board is easy to cure. With different curing agents, the epoxy resin system can be cured in the temperature range of 0 ~ 180 ℃.
3. Epoxy board has strong adhesion. The existence of polar hydroxyl and ether bond in the molecular chain of epoxy resin makes it have high adhesion to various substances. The shrinkage of epoxy resin is low and the internal stress is small, which also helps to improve the adhesion strength.
4. The shrinkage of epoxy board is low. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring opening polymerization of epoxides in resin molecules, without water or other volatile by-products. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) during curing.
5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.

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