Home » News » Some Factors of Poor Quality of Glass Fiber Board Surface (2)

Some Factors of Poor Quality of Glass Fiber Board Surface (2)

In the previous section, we mainly introduced three factors that caused the poor quality of the glass fiber board surface, the problem of substrate processing, and the oil stain or other caused by the board surface during machining (drilling, laminating, milling, etc.). The liquid contaminated by dust contaminated the surface and caused poor surface treatment, and the copper sink board was bad. Today we continue to introduce other factors that may also cause the glass fiber board surface to be of poor quality.
1. Water washing problems during the production of glass fiber board:
Because heavy copper electroplating treatment is subject to a large number of chemical treatments, various types of acid-base non-polar organic solvents and many other chemicals, the surface of the  glass fiber board is not washed with water, especially the copper adjustment of degreasing agents will not only cause cross-contamination, but also cause Poor local treatment of the  glass fiber board or poor treatment effect, uneven defects, causing some problems in the binding force; therefore, we must pay attention to strengthening the control of washing, mainly including washing water flow, water quality, washing time, and  glass fiber board dripping Control of time and other aspects; especially when the temperature is low in winter, the washing effect will be greatly reduced, and more attention should be paid to the control of washing;

2. During the manufacturing process of glass fiber board, the micro-etching during the pre-treatment of heavy copper and the pre-treatment of graphic plating:
Excessive micro-etching will cause the orifice to leak the substrate and cause blistering around the orifice; insufficient micro-etching will also cause insufficient bonding force and cause blistering; therefore, control of micro-etching should be strengthened; The etching depth is 1.5–2 microns, and the micro-etching before pattern plating is 0.3–1 microns. If possible, it is best to control the thickness or etching rate of micro-etching by chemical analysis and simple test weighing method. The surface of the etched glass fiber board is bright, uniform pink, and no reflection; if the color is uneven, or there is reflection, it indicates that there is a quality hazard in the pre-processing process; pay attention to strengthening the inspection; in addition, the copper content of the micro-etched tank, the temperature of the bath, and the load , Micro-etching agent content, etc. are all items to pay attention to;

3. Poor copper rework during glass fiber board manufacturing:
Some reworked copper or graphics reworked boards will cause blistering on the board due to poor faded plating, incorrect rework methods or improper micro-etching time control during rework, or other reasons. Defective copper can be removed directly from the wire after pickling after water washing, and pickling can be reworked without corrosion; it is best not to degrease again, and slightly etch; for the parts that have been thickened by the board, the micro-etching tank should be faded away. Pay attention to time control. You can use one or two plates to roughly measure the fading time to ensure the fading effect. After fading is completed of  glass fiber board, apply a set of soft brushes and then lightly brush the copper after normal plating. The etch time should be halved or adjusted if necessary.
In the actual production process of glass fiber board, there are many reasons for blistering on the board surface. For different manufacturers’ equipment and technology levels, there may be blistering caused by different reasons. The specific situation should be analyzed specifically, and other factors will be shared tomorrow.

Leave a message